Product Overview:
As a key functional material in the field of flexible electronics, polyimide (PI) film with copper coating has become an indispensable component in flexible circuit contexts, thanks to its unique combination of mechanical flexibility, thermal stability, and electrical conductivity. This material integrates the excellent properties of polyimide—such as high temperature resistance (able to withstand long-term use at 200–250°C), good chemical corrosion resistance, and low dielectric loss—with the high electrical conductivity of copper, effectively addressing the core demands of flexible circuits for both structural flexibility and reliable signal transmission.
In terms of technical design, the copper coating on the polyimide film is typically formed through processes like electroless plating, electrolytic plating, or vacuum sputtering, ensuring uniform thickness (ranging from a few micrometers to tens of micrometers) and strong adhesion between the copper layer and the PI substrate. This structural design not only enables the film to maintain flexibility even after repeated bending (with a bending radius as small as 0.1–1 mm in some cases) but also guarantees stable electrical performance, avoiding issues such as signal attenuation or circuit failure caused by coating peeling.
In flexible circuit contexts, this material finds wide application across multiple scenarios. For instance, in wearable electronics (e.g., smart bracelets, flexible sensors), it serves as the base circuit layer, adapting to the curved surfaces of human skin while transmitting physiological data stably. In flexible displays (such as OLED screens), it acts as a conductive interconnect, supporting the folding and rolling functions of the display without compromising image quality. Additionally, in automotive electronics (e.g., flexible printed circuits for in-vehicle infotainment systems) and aerospace equipment (where lightweight and high-temperature resistance are critical), polyimide film with copper coating replaces traditional rigid circuit boards, reducing device weight and improving adaptability to complex working environments.
Looking ahead, with the continuous development of flexible electronics toward miniaturization, high integration, and long service life, the demand for polyimide film with copper coating will further grow. R&D efforts are now focused on optimizing the coating process to reduce production costs, enhancing the film’s mechanical durability (to extend cycle life under repeated bending), and exploring multi-layer coating designs to meet the needs of more complex circuit architectures—solidifying its position as a core material in flexible circuit contexts.
