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Brand Name : Guofeng
Model Number : 25um
Certification : SGS Reach ROHS
Place of Origin : China
MOQ : 150kg
Price : $300-$30000
Payment Terms : L/C,T/T
Supply Ability : Negotiation
Delivery Time : 7 Working Days
Packaging Details : Standard Packing
Cladding Material : Copper
Surface Treatment : Chemical Etching
Material : Polyimide
Adhesive Type : Acrylic
Copper-Clad Polyimide Film (abbreviated as PI Copper Foil) is a high-performance composite material specifically developed for flexible circuit scenarios. It combines high-purity copper foil with a polyimide (PI) base film through a precision lamination process, integrating the bend resistance of flexible substrates and the electrical conductivity of metal conductors. As a core foundational material for flexible electronic devices, it enables the realization of "thinness, lightness, bendability, and high reliability"
Robust Mechanical Durabilit
Exceptional Dimensional Integrity
Excellent Lamination Performance
Compliant with RoHS and REACH


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Polyimide film clad with copper used in flexible circuit settings Images |