Lightweight Yellow Polyimide Thin Film PMDA ODA Molecular Structure

Extreme Thermal Stability

• Continuous service temperature range from -269°C to +400°C.

• Glass transition temperature (Tg) exceeding 400°C.

Excellent Mechanical Properties

• High tensile strength (≥200 MPa) and modulus (≥2.5 GPa).

• Outstanding flexibility and tear resistance even at ultrathin dimensions (e.g., 7.5-125 μm).

Superior Electrical Insulation

• Dielectric strength: ≥5,000 V/μm.

• Low dielectric constant (≈3.2 at 1 kHz) and dissipation factor.

Chemical and Radiation Resistance

• Resists organic solvents, acids, and radiation (gamma, X-ray).

• Minimal outgassing in vacuum environments.

Lightweight and Dimensional Stability

• Density: ~1.42 g/cm³, making it lighter than many metal alternatives.

• Low coefficient of thermal expansion (CTE: 30-50 ppm/°C).

Flame Resistance

• UL 94 V-0 rated; self-extinguishing without emitting toxic fumes.

Application Scenarios

• Aerospace and Aviation
  Used as thermal blankets, insulation for spacecraft wiring, and protective layers in satellite components due to its radiation resistance and thermal stability.

• Electronics and Semiconductors
  Employed as flexible printed circuit (FPC) substrates, coverlays, and stress buffers in microelectronics packaging for smartphones, wearables, and displays.

• Energy and Electric Vehicles
  Serves as insulation films for lithium-ion batteries, motor slot liners, and high-voltage capacitor dielectrics in EVs and renewable energy systems.